| 摘要 |
A fan device for dissipating heat of an electronic component includes a base 3 having a number of upward extending fins 31, 310. The fins 310 on the side portions are higher than the middle fins 31. A board 1 is secured above the shorter fins 31 and between the higher fins 310, and includes a number of orifices 12 for air circulation purposes. The board includes a support 11 securing a fan 2. The board may alternatively engage on top of the higher fins 310, or the fins may have identical height and include a depression formed in the middle for the fan. |
