| 摘要 |
PURPOSE: To increase the cooling effect of a semiconductor chip for connecting ball bump with the face-down of the chip and to reduce stress distortion to the bump. CONSTITUTION: A metal layer 2 and a pad 15 for cooling are formed on the reverse and front sides of a semiconductor chip 1, respectively. A nail-head system wire bonding is performed onto it using a metal small-gauge wire. Tail parts 4a and 4b are left by an arbitrary length as a bonding wire heat sink 6a, thus increasing the surface area by 60-80 times. By setting the cooling path of the semiconductor chip 1 as a bonding wire heat sink 6a and cooling fins 13a and 13b, stress distortion can be absorbed by a bonding wire heat sink 6a, thus improving the connection reliability of the ball bump 8 and hence manufacturing an inexpensive semiconductor device with improved cooling property and connection reliability in short TAT. |
