| 摘要 |
<p>PURPOSE: To provide a broken blade detection device which is capable of detecting a broken blade when a semiconductor wafer is cut off with the blade. CONSTITUTION: A semiconductor wafer is cut off with a rotating blade 4, and a load detector 20 connected to a spindle 2 used for rotating the blade 4 is provided. The load of the spindle 2 when the wafer is normally cut off with the blade 4 and the abnormal load when the wafer is abnormally cut off with the broken blade 4 are previously recognized by the load detector 4, and the spindle 2 is made to stop rotating at the time when the load detector 20 indicates an abnormal load when cutting the semiconductor water.</p> |
