EPOXY RESIN COMPOSITION FOR SEALING

摘要

PURPOSE: To provide an epoxy resin composition for sealing having good sealing properties and continuous moldability enough to reduce the formation of thin burrs and mold deposits and having good flow without detriment to the low stress of a molded product. CONSTITUTION: This composition comprises an epoxy resin and a curing agent being a silicone-modified phenolic resin prepared by reacting a novolac phenolic resin with a silicone having an epoxy group and a polyether group. It is required that the silicone content of the silicone-modified phenolic resin should be 0.1-3wt.% based on the entire composition, that the content of the inorganic filler should be 60-90wt.% based on the entire composition, that the inorganic filler should contain 1-10wt.%, based on the entire inorganic filler, spherical silica particles of a mean particle diameter of 3-5μm and also that the broken silica should comprise 5-20wt.% broken silica of a mean particle diameter of 0.5-5μm, 40-70wt.% broken silica of a mean particle diameter of 20-40μm and 25-40wt.% broken silica of a mean particle diameter of 80-100μm.