| 摘要 |
A dry sandblasting treatment for spraying abrasives onto a surface of an insulating resin layer, a chemical etching for chemically etching the surface, and a plating process for plating a conductive layer on the resulting insulating resin layer are successively performed. Since the surface of the insulating resin layer is roughened by the dry sandblasting treatment and the resulting surface is subjected to the chemical etching, a minute anchor structure is formed on the surface. Accordingly, the adhesion between the insulating resin layer and a plating layer (i.e., a circuit conductive layer) is improved. Due to the dry sandblasting treatment, the shape of a via hole formed in the insulating resin layer is improved, and an exposed surface of the circuit conductor layer and an inner wall of a through-hole are cleaned.
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