| 摘要 |
A heat sink assembly for computer chips includes a base plate, a fan and a combinative heat dissipation unit including a plurality of heat dissipation sheets having a plurality of slots therein and X-shaped washers which are alternatively stacked between the base plate and the fan. The combinative heat dissipation unit has a plurality of through openings from a top surface to a bottom surface thereof and transverse gaps in four side surfaces. The openings and gaps are in air communication thereby the heat generated by computer chips and conducted through the base plate to the combinative heat dissipation unit is rapidly carried away by air flow produced by the fan through the openings and gaps.
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