| 摘要 |
PURPOSE:To provide a semiconductor array formed by combining chips cut precisely from a wafer. CONSTITUTION:In an array of light-emitting devices 10, LED arrays 10a, 10b, 10c are arranged in a row, and light-emitting parts 11 are arranged at equal intervals in each of the LED arrays. A conducting layer 14 turning to an electrode is stuck on each of the light-emitting parts 11, and an aluminum thin film 15a is formed in the part adjacent to the LED array. |
