| 摘要 |
PURPOSE: To form a connection part uniformly when electronic devices are arranged in two or more rows, by using a bonding head having a wide operation range constantly in a bonding apparatus. CONSTITUTION: A bonding apparatus provides an electronic connection effectively between an bonding pad formed on a semiconductor device D and each electronic contact lead on a frame T, on which the semiconductor devices D are arranged. The bonding apparatus includes a supporting structure 2, a shifting device for moving the frame T along an operation face 3 of the supporting structure 2, a bonding head 4, and an accurate X-Y table 5 for supporting the bonding head 4 and positioning it accurately to the operation face 3. In addition, a carriage 10 is driven in a guided state across the supporting structure 2 in an sidewise direction at right angles to an elongated direction X, and the X-Y table is mounted on the carriage 10. |
