发明名称 RESILIENT PRESSURE CONTACT TERMINAL CONNECTION METHOD
摘要 PURPOSE:To reduce contact resistance by pressing the forward end of a jig against the contact face at a contact conductor part through a resilient terminal member and displacing a part of a supporting member and a circuit board relatively to the remaining part within such range as both contact faces are not subjected to frictional joint. CONSTITUTION:An ultrasonic bonder 6 descends vertically and abuts, at the forward end, against the surface of a terminal 1, with a predetermined pressure. Under that state, an ultrasonic oscillation element located at an upper part of the ultrasonic bonder 6 is operated to oscillate the forward end of the ultrasonic bonder 6 in the lateral direction. The terminal 1 and the contact conductor part 5 are not subjected to ultrasonic welding so that they can be separated later. Since the terminal 1 is oscillated in parallel with the contact face while being pressed against the contact conductor part 5, one contact face is deformed according to the micro irregularities on the other contact face or the micro irregularities are collapsed thus increasing the effective contact area. This structure reduces the contact resistance between both contact faces.
申请公布号 JPH0845992(A) 申请公布日期 1996.02.16
申请号 JP19940181139 申请日期 1994.08.02
申请人 NIPPONDENSO CO LTD 发明人 USAMI TOMOHIDE;HARADA YOSHIHARU
分类号 H01L21/603;H01L21/60;H01L25/04;H01L25/18;(IPC1-7):H01L21/603 主分类号 H01L21/603
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