| 发明名称 |
A multilayered metallurgical structure for an electronic component |
| 摘要 |
<p>Disclosed is a multilayered metallurgical structure for an electronic component. The structure includes a base metallurgy layer (58) which includes one or more layers of chromium, titanium, zirconium, hafnium, niobium, molybdenum, tantalum, copper and/or aluminum. Directly on the base metallurgy is a layer (60) of cobalt. The structure may also include a layer (62) of noble or relatively noble metal such as gold, platinum, palladium and/or tin directly on the cobalt.</p> |
| 申请公布号 |
EP0336869(B1) |
申请公布日期 |
1996.01.10 |
| 申请号 |
EP19890480025 |
申请日期 |
1989.02.28 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
AGARWALA, BIRENDRA NATH;BECKHAM, KEITH FOWLER;COOPER-JOSELOW, ALICE HAVEN;NARAYAN, CHANDRASEKHAR;PURUSHOTHAMAN, SAMPATH;RAY, SUDIPTA KUMAR |
| 分类号 |
H01L21/60;H01L23/498;H01L23/532;H05K3/24;(IPC1-7):H01L23/48;H01L23/52 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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| 主权项 |
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