发明名称 FINE PARTICLE FOR ABRADING CHEMICAL MACHINERY AND PRODUCTION THEREOF AND ABRADING METHOD USING THE SAME
摘要 <p>PURPOSE:To obtain the fine particles uniform in size, almost spherical in shape, also optimized in hardness and providing no mechanical damage on the surface to be abraded of a substrate even if an abrasion is made therewith. CONSTITUTION:An organometallic compound having metal-oxygen interatomic bond is subjected to emulsion polymerization to form metal oxide compound fine particles relatively low in hardness followed by forming therearound a metal oxide compound relatively high in hardness in a similar way, thus obtaining the fine particles optimized in hardness. For the present fine particles, the size distribution is limited within the range of average size 50% and the shape is almost spherical. By using a slurry containing the present fine particles, a substrate is subjected to chemical machinery abrasion to smooth this substrate.</p>
申请公布号 JPH083540(A) 申请公布日期 1996.01.09
申请号 JP19940139989 申请日期 1994.06.22
申请人 SONY CORP 发明人 MUROYAMA MASAKAZU
分类号 H01L21/304;B24B37/00;C09K3/14;(IPC1-7):C09K3/14 主分类号 H01L21/304
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