| 摘要 |
PURPOSE:To prevent the roughness of a cutting surface by conducting holing processing at a layered base plate surface through a water-soluble high molecule film layer whose chief element is a special water-soluble high molecule compound. CONSTITUTION:A water-soluble high molecule film layer forming material whose chief element is at least one of the elements shown by a formula I, a formula II, is prepared. Next, a water-soluble high molecule film layer is formed on at least a metal foiled base plate surface out of plural base plates forming a layered base plate, by using this water-soluble high molecule film layer forming material. The layered base plate is formed by layering plural base plates so that the water-soluble high molecule film forming metal foil surface of the metal foiled base plate may become a penetration hole start surface. Next, a penetration hole is piercingly provided at the layered base plate through the water-soluble high molecule film of the metal foil. The forming material is a water-soluble high molecule compound made up of the remaining group of an organic chemical compound having two activated hydrogen groups and the formula I and-(CH2CHO)-is contained contained more than 70wt.%. (But, A of the formula II is a unit to be made up of the repetition of the formula I, and R1 is a hydro-carbon group, and X is the remaining group of the organic chemical compound having two activated hydrogen groups, and R2 is the remaining group of a multivalue carboxylic acid kind chemical compound.) |
