发明名称 |
Liquid crystal display device having tape carrier with semiconductor device on flap portion |
摘要 |
A liquid crystal display device using a tape carrier packaged semiconductor device, which is designed to prevent a crack from developing in part of its resin mold. The semiconductor device is provided with a film-like substrate, a group of electrodes including a plurality of parallel electrodes, each of which is formed with its leading end conforming to one side of the film-like substrate and being elongated in the direction perpendicular to the one side thereof, a semiconductor chip mounted on the film-like substrate in such a manner that it abuts on the group of electrodes, located close to the one side thereof and connected via a wiring layer to the respective electrodes, and a resin mold for use in covering the semiconductor chip. Notches extending in the direction of the parallel electrodes are cut in the film-like substrate beneath the group of electrodes and wherein the leading and trailing ends of each electrode serves to link the electrode and the film-like substrate. A film-like substrate piece formed by the notch and used to support the leading end of each electrode is separated from the film-like substrate in the neighborhood of the resin mold.
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申请公布号 |
US5448387(A) |
申请公布日期 |
1995.09.05 |
申请号 |
US19930114627 |
申请日期 |
1993.09.02 |
申请人 |
HITACHI, LTD.;HITACHI DEVICE ENGINEERING CO., LTD. |
发明人 |
KUROKAWA, KAZUNARI;ABE, HIRONOBU;KITAGAWA, KAZUYUKI |
分类号 |
G02F1/1345;G02F1/13;H01L21/60;H05K1/18;H05K3/32;H05K3/36;(IPC1-7):G02F1/134;H05K1/00 |
主分类号 |
G02F1/1345 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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