Composition for forming controlled tin-lead solder alloy composition

摘要

A composition for forming an electrodeposited tin-lead alloy of controlled composition comprising: (a) about 1.5 to 1.8 percent by weight lead fluoroborate; (b) about 2.5 to 2.75 percent by weight tin fluoroborate; (c) about 91 to 92 percent by weight fluoroboric acid; (d) about 2.7 to 3.4 percent by weight boric acid; and (e) about 0.3 to 0.9 percent by weight Peptone, wherein the alloy comprises 62-64 weight percent tin and 36-38 weight percent lead.