| 摘要 |
PURPOSE:To maintain reliability with reduced cost by a method wherein the circumference of a semiconductor assembly is coated with hollow section forming agent to be contained in a case, filled with resin to be hardened, heated to vaporize or liquefy the hollow section forming agent, and discharged from the case to easily form the hollow section within an integrated circuit. CONSTITUTION:A semiconductor chip 1 is die-bonded on a die pad 2 with adhesives, etc., and a plurality of bonding pads 11 and lead wire 31 are wire- bonded. The wire-bonded assembly is coated with hollow section forming agent 7 such as urethaneprepolymer etc. Then, a case 81 made of resin is filled with thermosetting resin 85, the assembly is placed thereon, and the resin is hardened with heat. Then, the resin is hardened with, temperature more than the resin's thermosetting temperature to liquefy urethaneprepolmner, etc., as hollow section forming agent 7 inside so that it is discharged from the discharge hole 84 on the resin plate 82. A hollow section 16 is formed on the discharged position. |
