FORMATION OF BUMP

摘要

PURPOSE:To provide a method for forming bumps on the surface of a chip or a substrate at low cost. CONSTITUTION:A solder wire is cut off at a predetermined length and vacuum sucked to the rear surface of a pickup head. It is then transferred onto the surface of a chip 5 and fused thermally. Subsequently, it is cooled and solidified to form a hemispherical bump 11a. This method allows formation of bumps 11a easily on the chip 5 or the like easily using an inexpensive solder wire.