SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

摘要

PURPOSE:To enhance the reliability of bonding when a semiconductor device is manufactured by plate bonding the inner lead of a lead frame to an electrode on a semiconductor chip. CONSTITUTION:A protective layer 14 of metal paste is formed on an electrode pad 12 arranged on a semiconductor chip 11, for example. An inner lead 13 of a lead frame is then pressed, at the tip thereof, against the protective layer 14 thus conducting the inner lead 13 and the electrode pad 12 electrically. When a metal plating layer 15 is formed under that state, stabilized plate bonding is achieved.