HIGH-FLATNESS ETCHING OF WAFER AND DEVICE,申请号JP19930208961-传众专利搜索

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发明名称	HIGH-FLATNESS ETCHING OF WAFER AND DEVICE
摘要
申请公布号	JPH0745583(A)	申请公布日期	1995.02.14
申请号	JP19930208961	申请日期	1993.07.30
申请人	SHIN ETSU HANDOTAI CO LTD	发明人	KATO TADAHIRO;KUDO HIDEO
分类号	H01L21/306;(IPC1-7):H01L21/306	主分类号	H01L21/306
代理机构		代理人
主权项
地址

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