| 摘要 |
PURPOSE:To obtain a characteristic same as or more than a gold alloy fine line in the overall bonding property by making the tensile extension percentage in a palladium fine line within a specific scope. CONSTITUTION:This palladium, fine line for semiconductor element has the tensile extension percentage in the line direction within the scope 5 to 14%. The reason to set the above tensile extension percentage at 4 to 15% is like this. When the extension percentage is less than 5%, the strength is too high, and a poor connection or an unstable ball formation are generated in the second bonding condition and when it is more than 15%, the wire strength is lowered and a wire bending following the reduction of the linear advancing property of a loop immediately after the bonding is made remarkable. By using such a palladium fine line as a bonding wire, a good connection with a lead frame, and a continued bonding property can be improved. |
