发明名称 |
Press-contact type semiconductor device |
摘要 |
In a semiconductor device, a pellet electrode, which is formed on a mesa-shaped pellet, and an external electrode, with which a package is provided, are in pressure-contact with each other. A soft-metal plate which has projections along its surface is arranged between the external electrode and the pellet electrode.
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申请公布号 |
US5360985(A) |
申请公布日期 |
1994.11.01 |
申请号 |
US19930070040 |
申请日期 |
1993.06.01 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
HIYOSHI, MICHIAKI;FUJIWARA, TAKASHI;SUZUKI, HISASHI;MATSUDA, HIDEO |
分类号 |
H01L29/74;H01L21/52;H01L23/051;H01L23/48;(IPC1-7):H01L23/02 |
主分类号 |
H01L29/74 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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