The present invention relates to an improved flex (or TAB) product suitable for silicon carrier or other types of chip carrier applications, wherein the flex reliability problems caused for example by Cu thermal cycling are substantially reduced or eliminated. More particularly, the invention embodies a number of coatings for use in such products and diverse methods of making and using same.
申请公布号
US5360946(A)
申请公布日期
1994.11.01
申请号
US19910761182
申请日期
1991.09.17
申请人
INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人
FEGER, CLAUDIUS;GRAHAM, TERESITA O.;GREBE, KURT R.;LANZETTA, ALPHONSO P.;LIUTKUS, JOHN J.;MATTHEW, LINDA C.;PALMER, MICHAEL J.;TANNER, NELSON R.;TONG, HO-MING;WILSON, CHARLES H.;YEH, HELEN L.