发明名称 |
Die-attach composition comprising polycyanate ester monomer |
摘要 |
In accordance with the present invention, there is provided a novel composition for attaching a semiconductor device to a substrate. The invention composition comprises liquid polycyanate ester monomer, electrically conductive filler rendered substantially free of catalytically active metal ions and a curing catalyst. Treatment of filler to render it free of catalytically active metal ions significantly extends the pot life of the composition.
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申请公布号 |
US5358992(A) |
申请公布日期 |
1994.10.25 |
申请号 |
US19930023962 |
申请日期 |
1993.02.26 |
申请人 |
QUANTUM MATERIALS, INC. |
发明人 |
DERSHEM, STEPHEN M.;DERFELT, DEBORAH L.;PATTERSON, DENNIS B. |
分类号 |
C08G73/06;C08K3/08;H01B1/22;(IPC1-7):C08K3/08;C08K5/09;H01B1/02;C08G73/00 |
主分类号 |
C08G73/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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