| 摘要 |
PURPOSE:To make it possible to perform continuous molding with a simple configuration by providing a high use efficiency of materials, easy handling and greatly improved coefficient of thermal expansion and coefficient of thermal conductivity. CONSTITUTION:A first tape 11a and a second tape 11b have recessed portions 12 at the equal spacings, and resins 13a and 13b forming a package are placed in the recessed portions 12. IC pellet 15 provided for a lead frame 14 is continuously sealed by the resins 13a and 13b provided on the first and second tapes 11a and 11b. Since the resins are retained by the first and second tapes 11a and 11b, the use efficiency is high and handling is easy and the package can be continuously molded by a simple configuration. |
