发明名称 Symmetric SRAM cell with buried N+ local interconnection line
摘要 A symmetrical, SRAM silicon device comprises substrate comprising a semiconductor material with, a set of buried local interconnection lines in the silicon substrate. A word line is located centrally on the surface of the device. Pull down transistors are located symmetrically one either side of the word line. Interconnections are formed in the same layer as a BN+ diffusion. There is only one wordline composed of polysilicon. The pull down transistors are located on opposite sides of the word line. The cell size is small. There is no 45 DEG layout, and the metal rule is loose. Pass transistor source and drain regions are in the substrate juxtaposed with the buried local interconnection line. There is a layer of gate oxide above the source region and the drain region, and a gate adore the gate oxide juxtaposed with the source region and drain region.
申请公布号 US5354704(A) 申请公布日期 1994.10.11
申请号 US19930102978 申请日期 1993.07.28
申请人 UNITED MICROELECTRONICS CORPORATION 发明人 YANG, MING-TZONG;HSUE, CHEN-CHIN
分类号 H01L23/535;H01L27/11;(IPC1-7):H01L21/70 主分类号 H01L23/535
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