发明名称 |
Thermosetting resin compositions |
摘要 |
A thermosetting resin composition contains (A) a mixture of an imide compound having an allyl-free maleimide group and an imide compound having an allyl-containing imide group, (B) an epoxy resin, (C) a phenolic resin, and optionally, (D) an aromatic polymer/organo-polysiloxane copolymer. Component (B) and/or (C) includes a compound containing a naphthalene ring having a double bond conjugated with an aromatic ring. The composition is easily workable and well adhesive and cures to products having improved mechanical strength, hot-water resistance, low thermal expansion, and minimized water absorption.
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申请公布号 |
US5340851(A) |
申请公布日期 |
1994.08.23 |
申请号 |
US19930017290 |
申请日期 |
1993.02.12 |
申请人 |
SHIN-ETSU CHEMICAL COMPANY, LTD. |
发明人 |
SHIOBARA, TOSHIO;SHIMIZU, HISASHI;TAKEI, MINORU |
分类号 |
C08G59/00;C08G59/40;C08G59/62;C08L63/00;H01B3/40;H01L23/29;(IPC1-7):C08G59/40 |
主分类号 |
C08G59/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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