发明名称 Lead frame with deformable buffer portions
摘要 A lead frame has a central portion and groups of lead terminals distributed around the four peripheral sides of the central portion, along with main buffer portions coupling the lead terminals together in corresponding groups to prevent warping of the lead frame as a result of contraction of an injection-molded resin body during hardening. In addition, slits are provided outside the buffer portions which extend farther at one end of the slits than the corresponding side of the resin body, and auxiliary buffer portions located at both ends of the slits support the main buffer portions.
申请公布号 US5338972(A) 申请公布日期 1994.08.16
申请号 US19930052554 申请日期 1993.04.23
申请人 ROHM CO., LTD. 发明人 NEGORO, ATSUHITO
分类号 H01L21/56;H01L23/28;H01L23/495;H01L23/50;(IPC1-7):H01L23/48;H01L29/46;H01L29/62;H01L29/64 主分类号 H01L21/56
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