发明名称 CAPILLARY CHIP FOR WIRE BONDING
摘要 PURPOSE:To provide a capillary chip for wire bonding which hardly causes attaching and fusing of a wire material and withstands a long period use. CONSTITUTION:This capillary chip is a capillary chip A for a wire bonding wherein at least a tip part 101 of the tip part 101 and a wire guide hole 102 which is continuous with the tip part is coated with a hard ceramic film 103 which hardly causes wire leakage.
申请公布号 JPH06209026(A) 申请公布日期 1994.07.26
申请号 JP19930001730 申请日期 1993.01.08
申请人 NISSIN ELECTRIC CO LTD 发明人 IMAI OSAMU
分类号 H01L21/60 主分类号 H01L21/60
代理机构 代理人
主权项
地址