VARIABLE SIZE CAPTURE PADS FOR MULTILAYER CERAMIC SUBSTRATES AND CONNECTORS THEREFOR

摘要

Capture pads (55a-55p) of variable size are provided on the face of a multilayer ceramic substrate (21), to accommodate the actual skrinkage tolerance of the substrate at each capture pad position. By sizing each capture pad based on the maximum positional variation at the particular capture pad position, higher contact density is obtainable than with known uniform size capture pads. The variable size capture pads (55a-55p) may also be used at one or more rows of capture pads located along one or more edges (21d) of the substrate, for electrical connection to an edge connector (35). Edge connectors (35) with variable spacing of the edge connector contacts are also provided. Capacitive ground plane (23) coupling to the variable size capture pads is made uniform by providing a uniform size ground plane region adjacent each capture pad, with the uniform size being smaller than the smallest capture pad. A high density microelectronic substrate is hereby obtained without degrading the performance of the substrate.