| 摘要 |
PURPOSE:To obtain a board for multilayer printed wiring which improves drilling machinability, resistance to haloing and decrease in permittivity without damaging size stability with respect to heat. CONSTITUTION:A board for multilayer printed wiring wherein a glass-cloth-base prepreg sheet B and a copper foil 4 are arranged respectively on the front and rear sides of a glass nonwoven-fabric base prepreg sheet A and these are laminated into one body, and on the front and rear sides of a double-sided copper-clad laminated board of this complex structure, a glass cloth base prepreg sheet C in which the quantity of resin is increased by attaching a 50-55% of epoxy resin to a glass cloth of 0.18mm nominal thickness and the copper foil 4 are laminated respectively, and then the whole substrate is heated and pressed into one body of lamination. |
