PRODUCTION OF PRESSURE-SENSITIVE ADHESIVE TAPE FOR SURFACE PROTECTION OF SEMICONDUCTOR WAFER

摘要

PURPOSE:To produce in good productivity a pressure-sensitive tape having an adhesive layer not staining the surface of a semiconductor wafer. CONSTITUTION:A pressure-sensitive adhesive is applied to on surface of a release film having a surface tension of below 35dyn/cm and a Vicat softening point of 100 deg.C or above and dried to form a pressure-sensitive adhesive layer, and a base having a surface tension of 35dyn/cm or above is laminated on the surface of the pressure-sensitive layer and pressed against it to transfer the adhesive layer from the surface of the film to the surface of the base.