发明名称 |
Semiconductor die packages having lead support frame |
摘要 |
A reusable transport and test tape which includes a plurality of insulated conductors adapted to receive and connect to the leads of the lead pack and to position the lead pack for reception of an integrated circuit for bonding of lead pack leads to the contact pads of the integrated circuit and to move the lead pack and integrated circuit into succeeding processing stations where the circuit is tested and packaged. |
申请公布号 |
US5285105(A) |
申请公布日期 |
1994.02.08 |
申请号 |
US19920912030 |
申请日期 |
1992.07.09 |
申请人 |
TRIBOTECH |
发明人 |
CAIN, EARL S. |
分类号 |
H01L21/68;H01L23/495;H01L23/498;(IPC1-7):H01L23/48;H01L29/44;H01L29/52;H01L29/60 |
主分类号 |
H01L21/68 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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