| 摘要 |
<p>PURPOSE:To obtain a semiconductor mounting board which can be commonly used for a circuit having partly different function by providing grooves for passing a wiring pattern on a printed circuit board or grooves for interrupting the pattern, mounting a semiconductor device, and forming a structure in which the wiring passing in the groove are solder-connected in the groove. CONSTITUTION:In the case of applying to a memory module, grooves 3 (31-35) are provided on a surface of a board 1 in which an IC memory 2 is mounted and printed wirings are provided, and groove conductors 8 (81-85) of printed wirings or equivalent wiring materials are formed on walls and bottoms of the grooves 3. Wirings 4 (41-45) are connected to the conductors 8, and connected at one end to a board terminal, and at the other to the printed wirings. The conductors 8 are cut substantially at the center of the groove 3, the cut conductor 81 of the groove 31 is connected to operate the memory 2 in a specific operation mode, or to prevent the specific operation, thereby obtaining a memory product having different functions.</p> |
