| 摘要 |
PURPOSE:To provide a laser element wherein the light emitting position is controlled with high accuracy before die bonding to enhance accuracy of light emitting position by detecting the light emitting point from light emitting output of a semiconductor laser chip which is activated by supplying the power and then obtaining position information of the semiconductor laser chip from the detection result. CONSTITUTION:A semiconductor laser chip 1 which emits the laser beam is mounted to a supporting means for the purpose of positioning. In such positioning process, a semiconductor chip 1 which has been divided into each chip is put on a stage 2 and each chip 1 is activated for emission of light. Thereby, light emitting position can be detected from such light emitting output. A position information of the semiconductor chip 1 is obtained from the detection result. For instance, the light emitting position can be detected by condensing the emitted light to the surface of the one light emitting end of the semiconductor chip 1 and then reflecting the light, returning again the reflected light to the semiconductor laser chip 1 and then detecting change of current or optical output of the semiconductor laser 1 at that time.
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