发明名称 Method of connection testing electronic boards.
摘要 <p>A method based on the observation that the clamping diodes (4, 8) between pins (2, 3) having similar functional characteristics form multicollector structures, which, when biased, supply comparable collector currents in the event of correct connection. The method therefore comprises stages consisting in grouping (30) the clamping diodes (4, 8) according to function or structure; biasing (32) the resulting multiterminal structures (10) so as to produce currents (ICi); measuring (33) the currents; comparing (35, 36) the measured currents; and detecting (36, 37) faulty connections on the basis of marked variations in the currents. &lt;IMAGE&gt; &lt;IMAGE&gt;</p>
申请公布号 EP0571963(A2) 申请公布日期 1993.12.01
申请号 EP19930108451 申请日期 1993.05.25
申请人 SPEA S.R.L. SISTEMI PER L'ELETTRONICA E L'AUTOMAZIONE 发明人 BONARIA, LUCIANO
分类号 G01R31/04;G01R31/28;(IPC1-7):G01R31/04 主分类号 G01R31/04
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