| 摘要 |
PURPOSE: To obtain a water-developable photosensitive compsn. which is used as a high-resolution solder mask in production of printed circuit boards. CONSTITUTION: The binder of the water developable photoiamge formable compsn. contg. the binder and curing system contains a mixture composed of a phenolic resin and a compd. having at least two reactive functional groups selected from a group consisting of an epoxy group, vinyl ether group and a mixture composed of the epoxy group and the vinyl ether group and the curing system contains a photoactive compd. capable of forming a curing catalyst. The phenolic resin exists in the amt. sufficient for making the non-exposed parts of the compsn. alkaline-soluble. The compd. having the reactive functional group exists in the amt. to allow the curing of the compsn. The curing system exists in the amt. to allow the curing of the components of the binder when the system is exposed to activation radiations.
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