发明名称 MANUFACTURE OF LEAD FRAME FOR POWER TRANSISTOR
摘要 PURPOSE:To prevent effectively the generation of resin burrs at a heat sink part by a method wherein the clearances between lugging punches and a knockout for pressing the heat sink are made large. CONSTITUTION:Clearances A between a knockout 6 and lugged punches 7 are set at a value of 20mum or thereabouts to perform a lugging work by a press processing. Thereby, when a heat sink 2 is subjected to press processing and lug parts 5 are formed, a material is formed into a risen form at the edge parts of step parts 5a and projected edge parts 10 are formed. The height of the parts 10 is formed in 2 to 4mum. In respect to the parts, on which the parts 10 are formed, of the exposed surface of the sink 2, a resin molding is conducted. Thereby, run of a molding resin to the back is effectively suppressed and the generation of resin burrs can be effectively prevented.
申请公布号 JPH05226532(A) 申请公布日期 1993.09.03
申请号 JP19920061189 申请日期 1992.02.17
申请人 APITSUKU YAMADA KK 发明人 TAKEZAWA TOSHINARI
分类号 H01L21/56;H01L23/28;H01L23/48 主分类号 H01L21/56
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