DEVICE FOR MOUNTING SEMICONDUCTOR CHIP

摘要

PURPOSE:To provide a device for mounting a semiconductor chip by which the aligning time of a semiconductor chip and a semiconductor chip mounting board in the mounting of a flip chip method. CONSTITUTION:A semiconductor chip suspending stage 6 for suspending a semiconductor chip 4 by vacuum clamp is vertically movably arranged directly above a semiconductor chip mounting board 1. Then, a semiconductor chip guide 8 which has a generally U-shaped outline when viewed from above and which guides and direct a chip 4 in a prescribed direction is integrally provided encircling the vertical walls of a semiconductor chip 4 on the periphery of the flat underface of the semiconductor chip suspending stage 6 with reference to the size of the semiconductor chip 4.