| 摘要 |
In discrete wafer-scale integration abbreviated as WSI, pre-tested chips are mounted and bonded on a pre-wired wafer. Silicon usually serves as the wafer substrate because the wafer wiring can be cost-beneficially produced with a standard multi-layer process. The conducting properties of such a wafer micro-wiring forbid the use of long leads given high timing clocks, so that intermediate drivers must be utilized. Previous solutions make use of separate driver chips that must be placed, bonded and tested in addition to the actual function chips. In the disclosed WSI system, the intermediate drivers are not realized as separate chips but are implemented on the function chip itself.
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