| 摘要 |
<p>PURPOSE:To prevent positional deviations from a first groove already formed by performing alignment on the basis of the first groove before forming a second groove. CONSTITUTION:In a first cutting process, a rotary blade on a dicing equipment makes a first groove along a street on a semiconductor wafer 2 by half cutting. The semiconductor wafer 2 is subjected to treatment, such as etching, in the subsequent non-groove-formation process, and then returned onto the holding table 1. In a second alignment process, alignment is performed by an image recognition means. This image recognition is on the base of the first groove 5 already formed in the first cutting process, not circuit patterns. This provide a high alignment accuracy.</p> |
