发明名称 JIG FOR SINTERING ELECTRONIC PARTS
摘要 PURPOSE:To provide a jig used at the time of sintering electronic parts by forming a layer which reacts hardly with the electronic parts and has such a structure as to prevent easy exfoliation even under heat history on the surface of a substrate by thermal spraying. CONSTITUTION:An alumina-based thermally sprayed layer as a first layer is formed on the surface of an aluminous or aluminous-siliceous substrate having >=85wt.% Al2O3 content and a thermally sprayed layer of unstabilized zirconia as a second layer is further formed on the first layer to obtain a jig for sintering electronic parts.
申请公布号 JPH05178673(A) 申请公布日期 1993.07.20
申请号 JP19910358599 申请日期 1991.12.27
申请人 KYUSHU REFRACT CO LTD 发明人 WATANABE AKIRA;KONO KOJI;TAKAYAMA YOSHIO;WATANABE IWAO
分类号 B05D1/08;C04B35/48;C04B35/64;C04B41/90;H01G4/12;H01G13/00 主分类号 B05D1/08
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