发明名称 |
JIG FOR SINTERING ELECTRONIC PARTS |
摘要 |
PURPOSE:To provide a jig used at the time of sintering electronic parts by forming a layer which reacts hardly with the electronic parts and has such a structure as to prevent easy exfoliation even under heat history on the surface of a substrate by thermal spraying. CONSTITUTION:An alumina-based thermally sprayed layer as a first layer is formed on the surface of an aluminous or aluminous-siliceous substrate having >=85wt.% Al2O3 content and a thermally sprayed layer of unstabilized zirconia as a second layer is further formed on the first layer to obtain a jig for sintering electronic parts. |
申请公布号 |
JPH05178673(A) |
申请公布日期 |
1993.07.20 |
申请号 |
JP19910358599 |
申请日期 |
1991.12.27 |
申请人 |
KYUSHU REFRACT CO LTD |
发明人 |
WATANABE AKIRA;KONO KOJI;TAKAYAMA YOSHIO;WATANABE IWAO |
分类号 |
B05D1/08;C04B35/48;C04B35/64;C04B41/90;H01G4/12;H01G13/00 |
主分类号 |
B05D1/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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