VERFAHREN UND APPARAT ZUM VERKAPSELN EINER ELEKTRONISCHEN ANORDNUNG.

摘要

A method and apparatus to encapsulate a device (24) and joints (26, 28) coupled to conductive leads (30) with an encapsulating material (42). A fixture (12) has a recess to hold via a vacuum (16) the device (24) in place. Conduits in the fixture supply air (20) around the device (24) to form an air dam that flows outward around the device (24) and the leads (30). A nozzle (40) supplies a metered amount of material (42) to the surface of the device (24). By controlling the temperature of the fixture (12) and/or the air (20) forming the air dam, the flow of material can be confined to the surface of the device (24) and the joints (26, 28) as it cures. The method can also provide encapsulant edge capping to reduce device stresses.