| 发明名称 |
CONDUCTIVE ADHESIVE COMPOSITIONS BASED ON THERMALLY DEPOLYMERISABLE POLYMERS |
| 摘要 |
An electrically or thermally conductive adhesive composition which comprises at least one thermally depolymerisable polymer which decomposes to volatile or gaseous products at a temperature in the range of from 100 DEG C to 350 DEG C and silver, gold, aluminium nitride, alumina, aluminium, copper, nickel, silicon, diamond or silver coated-particles, or a mixture thereof. |
| 申请公布号 |
WO9312190(A1) |
申请公布日期 |
1993.06.24 |
| 申请号 |
WO1992GB02290 |
申请日期 |
1992.12.10 |
| 申请人 |
COOKSON GROUP PLC |
发明人 |
WAGLAND, ALISON, MARY;PRICE, ANDREW, DAVID;PATERSON, GEOFFREY, ANDREW;KING, CHARLES, EDMUND;SOUTAR, ANDREW, M'INTOSH |
| 分类号 |
C09J167/02;C09J169/00;C09J201/00;H01B1/20;H01B1/22;H01B1/24;H01L21/60;H01L23/482;H05K3/32 |
主分类号 |
C09J167/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
