发明名称 PROCESS FOR FORMING MULTILAYER FILM AND PROCESS FOR FABRICATING DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a process for depositing a multilayer film exhibiting good inter-film adhesion and interface characteristics, and to provide a process for fabricating a device using that film deposition process. <P>SOLUTION: The process for forming a multilayer film including at least a first film and a second film formed thereon comprises a step for coating a substrate with a first liquid material containing solvent to form a first coating, a step for removing at least a part of the solvent existing in the first coating to form a first solvent removed film, a step for coating the first solvent removed film with a second liquid material, and a step for performing heating and/or optical treatment at least of the first solvent removed film and the second liquid material to form the first film from the first solvent removed film and the second film from the second liquid material. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2005235852(A) 申请公布日期 2005.09.02
申请号 JP20040040238 申请日期 2004.02.17
申请人 SEIKO EPSON CORP 发明人 AOKI TAKASHI
分类号 H01L31/04;H01L21/208;H01L21/336;H01L29/786;(IPC1-7):H01L21/208 主分类号 H01L31/04
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