首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
MOUNTING OF IC PACKAGE WITH LEAD PIN
摘要
申请公布号
JPH05121599(A)
申请公布日期
1993.05.18
申请号
JP19910282947
申请日期
1991.10.29
申请人
OLYMPUS OPTICAL CO LTD
发明人
HATTORI HIROSHI;AZUMA MOTOO
分类号
H01L23/32;H05K3/30
主分类号
H01L23/32
代理机构
代理人
主权项
地址
您可能感兴趣的专利
High-pressure discharge lamp and heat shield for such a lamp
Sorting sequential data prior to distribution over parallel processors in random access manner
Gripping sleeve apparatus and method of using the same
Packet video signal inverse transport processor memory address circuitry
Controllable valve arrangement for controllable two-tube vibration absorbers
Spool for yarn composed of two rings side by side, on the inner surface of which several U-shaped brackets are butt- welded, having the ends of the arms squashed
Wash-drier machine with mobile brushes
Probe-type sensor for colorimetric measurement, particularly for dentistry
Wash-drier machine with additional brush with a single fast coupling
Mechanism for applying double-sided adhesive tapes or the like
NON-CONTACT INFORMATION RECORDING MEDIUM AND GATE SYSTEM
NEW CHLOROPHYLL-BASED COMPOUND AND ITS USE
MANUFACTURE OF IC CARD
SEMICONDUCTOR DEVICE
BOTTLE INSPECTION APPARATUS
COMPRESSED FOAM AND ITS PRODUCTION
GLASS SUPPORTING MEMBER OF HEAT COLLECTING DEVICE
PREPARATION FOR FINE POWDER-CONTAINING GRANULE
CONTROL DEVICE FOR POWER CONVERSION APPARATUS
POWER UNIT FOR AUTOMOBILE