| 摘要 |
<p>PURPOSE:To obtain an economic film carrier generating no cracks on a lead part when a bonding operation is conducted. CONSTITUTION:A coated layer 14, consisting of Pd or a Pd alloy (Pd-Ni, Pd-Co, Pd-Cu, etc.), or Ru or an Ru alloy (Ru-Ni, Ru-In, etc.) is formed on the lead part including the inner lead 3 and the outer lead 4 of a film carrier. The above- mentioned coated layer has excellent oxidation-resistant property and excellent bondability, no cracks are generated on the lead part when a lead part is bonded on a semiconductor chip even when the width of the lead part is microscopically formed into 100mum or smaller, and the lead part is not oxidized by heat. As a result, the lead part can be bonded to a semiconductor chip in a highly reliable manner. The thickness of the coated layer should be within the range of 0.1 to 1mum.</p> |
