| 摘要 |
PURPOSE:To provide a lead frame which does not generate cracks on a package where a semiconductor chip is mounted when a semiconductor device is heated at a high temperature to mount especially a printed board or the like with regards to a lead frame which is used to constitute a semiconductor device, for example, a resin package type semiconductor device. CONSTITUTION:In a lead frame where a semiconductor chip 51 is mounted on the surface and a die stage 11 sealed with a resin-made package 53 is provided, the lead frame is clad with a flat bar-shaped component 31 on the rear side of the die stage 11 where the contact strength with the package 53 is smaller than the contact strength with the rear side.
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