| 摘要 |
PURPOSE:To provide a simple correcting operation and to eliminate a damage of a lead in a method and an apparatus for correcting leads of a surface mounting type component and particularly a DIP (dual in-line package) component. CONSTITUTION:Leads 2 of a surface mounting type component 1 are held in an aligned state in an alignment block 10 formed of a lower block 11 and an upper block 12, and motions for bending the leads 2 until roots of the leads 2 are plastically deformed in either upward or downward direction and returning them, are applied to the block 10. |
