| 摘要 |
<p>PURPOSE:To provide the cooling apparatus and the cooling method, of a wafer, wherein the temperature of the wafer can be cooled simply and rapidly in the cooling apparatus and the cooling method, of the wafer, which are used in the manufacturing process of a semiconductor device. CONSTITUTION:The title apparatus is provided with the following: a cooling plate 1 which is cooled by means of a cooling device 2 and in which a wafer 11 is mounted on its surface; a chamber 3 which forms a hermetically sealed space when it is brought into close contact with the peripheral part of the cooling plate 1; a holder 10 which holds the wafer 11 by keeping a definite interval from the surface of the cooling plate 1; a pressure sensor 4 which detects a pressure inside the chamber 3; a valve 5, for vacuum use, which is installed in the chamber 3; a metering valve 7 and a valve 6, for nitrogen use, which are installed in the chamber 3; and a temperature sensor 8 which detects a temperature inside the chamber 3. The title apparatus is constituted so as to provide a controller 9 which controls the valve 5 for vacuum use and the valve 6 for nitrogen use by means of the pressure sensor 4 and the temperature sensor 8.</p> |
