| 摘要 |
<p>PURPOSE:To provide a method for forming a dielectric thin layer on a light input/output surface of a semiconductor element by improving productivity and yield. CONSTITUTION:A jig for so holding a semiconductor element as to expose both light input/output surfaces, is used to form dielectric thin film layers only on the light input/output surfaces. A plurality of barlike chip groups 1 are so placed on a barlike chip group placing part 6 of a sample base 3 that light input/output surfaces are located on upper and lower surfaces, a fastener 3 is inserted to press a pressing surface 4 to the groups 1, and clamped by screws 5. The set jig is set in a film forming device, and the dielectric thin film layer is formed on one side of the input/output surfaces of the group 1. In order to form the dielectric thin film layer on the other side of the light input/output surfaces, the jig may be inverted upside down without removing the group 1 from the jig. Thus, the film layers can be formed on the input/output surfaces.</p> |
