| 摘要 |
PURPOSE:To reduce the function test of a single semiconductor element and the mounting area of the semiconductor element. CONSTITUTION:Solder bumps 4 are formed on the connecting pads of a pair of semiconductor elements 3 which are mutually dependent functionally and are facing each other. A TAB inner lead 5 connected to TAB lead frames 7 is sandwiched by the solder bumps 4 and the semiconductor elements 3 are connected. After connecting the semiconductor elements 3 and performing function test, a TAB outer lead 6 is connected with the TAB lead frame 7 and the TAB outer lead 6 is connected with the circuit conductor 2 of a circuit board 1. |
